RM182X · M.2 2280 AI Compute Co-Processor Module
Overview
RM182XMC0 (including RM1820MC0 and RM1828MC0) is a high-performance AI compute co-processor module supporting 3B / 7B large models (RM1820MC0 supports 3B, RM1828MC0 supports 7B). It is designed for AI inference and machine vision — especially artificial-intelligence-related applications.
The module carries Rockchip's RK182X co-processor and uses an M.2 Key M gold-finger connector, measuring 22mm × 80mm. Customers only need to design a simple carrier board to integrate the module into edge or embedded devices, enabling fast development.
Product Appearance



Highlights
Large-model inference delivered as a standard M.2 2280 card. As long as your host has a free PCIe M.2 slot, dropping in one card adds 20 TOPS of local compute — no host replacement, no cloud round-trip.
| Feature | Specification |
|---|---|
| Compute | 20 TOPS @ INT8 |
| Data types | INT4 / INT8 / INT16 / FP8 / FP16 / BF16 |
| On-chip DRAM | RK1820: 2.5GB | RK1828: 5GB (hundreds of GB/s bandwidth) |
| CPU | 3× 64-bit RISC-V (SRV, VRV0, VRV1) |
| Interface | M.2 Key M, PCIe 2.1 communication |
| Dimensions | 22mm × 80mm |
| LLM support | RK1820 → 3B | RK1828 → 7B |
Supported Models
| Category | Models |
|---|---|
| Large language models | Qwen 2.5 0.5B / 1.5B / 3B, Qwen 3 0.6B / 1.7B |
| Multimodal | FastVLM |
| Image classification | MobileNetV1, MobileNetV2, ResNet50V2 |
| Object detection | YOLOv5s, YOLOv6s, YOLOv8s |
Software Stack
| Component | Description |
|---|---|
| RKNN3 Toolkit | PC-side development kit for model conversion and quantization |
| RKNN3 Runtime | On-device runtime API |
| RKNN3 Model Zoo | Model conversion and deployment examples |
Measured Performance
Input tokens: 128
| Model | Mode | TTFT (ms) | TPS (tokens/s) | Avg power | Peak power |
|---|---|---|---|---|---|
| Qwen2.5 3B | Power-save | 144.455 | 54.537 | 5.35W | 15.14W |
| Qwen2.5 3B | Standard | 96.05 | 77.945 | 7.2W | 24.86W |
| Qwen2.5 7B | Power-save | 288.255 | 35.044 | 7.02W | 16.11W |
| Qwen2.5 7B | Standard | 186.435 | 51.476 | 10.4W | 27.28W |
TTFT (Time To First Token) is first-token latency — how long before output starts. TPS (Tokens Per Second) is generation speed — how fast output flows. Together they define the interactive feel.
Power Requirements
Besides 3.3V drawn from the M.2 socket, the module requires an additional 12V supply from the carrier board.
| Rail | Source | Specification |
|---|---|---|
| 12V | Dedicated header on carrier board | 12V / 3A |
| 3.3V | M.2 socket on carrier board | 3.3V / 3W |
The RK1820 M.2_2280 Module requires the carrier board to supply an additional 12V/3A rail. The M.2 socket's 3.3V alone cannot drive the module — a dedicated 12V supply must be designed on the carrier board.
Application Block Diagram
HOST RM182XMC0
┌──────────────┐ ┌──────────────────┐
│ │ PCIe 2.1 1lane │ │
│ PCIe RC │◄──────────────────►│ PCIe0 (EP) │
│ │ │ │
│ PCIE0_PERSTN├───────────────────►│ RESETN_IN │
│ PCIE0_CLKREQ├───────────────────►│ PCIe CLKREQn │
│ PCIE0_WAKEN ├───────────────────►│ PCIe WAKEn │
│ │ │ │
│ FAN_CTRL ├───────────────────►│ Fan speed CTL │
│ FAN_SPEED │◄───────────────────│ Fan speed DET │
│ │ │ │
│ 3.3V_IN ├───────────────────►│ VCC_IN 3.3V │
│ 12V ├───────────────────►│ VCC_IN 12V │
└──────────────┘ └──────────────────┘
Next Steps
- Full specifications → RM182X Hardware Specification
- Carrier board design → RM182X Hardware Design Guide
- Get materials → Downloads